Applications of 3050 C & CT for AdhesivesApplications of 3050 C & CT for Adhesives


Hardeners 3054C & 3054CT

Structural Epoxy Adhesive

  • Structural epoxy adhesive for demanding applications
  • Ambient temperature curing.
  • 1/1 mixing ration in volume.
  • Thixotropic version, 3050CT available for non-sag vertical surface applications.

The Resoltech 3050C & 3050CT epoxy adhesive is a rubber toughened, high performance adhesive that will enable bondings with very high mechanical resistance (310 kg/cm2) and high peel-resistance. It’s curing at ambient temperature and 1/1 mixing ratio in volume or 100:80 by weight makes of the 3050C &3050CT an easy product to work with.
It will enables structural bondings of all types of composite materials, steel, aluminium, wood and will resist in a large range of operating temperatures from -50°C to +80°C, with a maximum service temperature of 140°C.
It is a solvent less adhesive with no contraction upon curing.
The 3050C/3054C is for horizontal applications only.
The 3050CT/3054CT is a thixotrpic version that will enable bondings in all application conditions

TG (°C)
Mix density
Mix viscosity (mPa.s)
Gel time on 70 mL, 4cm at 23°C