Applications of HTGL 210 for Applications of HTGL 210 for

RESOLTECH HTGL 210

Hardener HTGL 216

High TG structural wet layup epoxy system

  • High TG 210°C
  • Low viscosity and high wetting out properties

RESOLTECH HTGL 210 / HTGL 216 epoxy system is very high TG resin specially formulated for the production of tooling and large structural composites parts requiring TG’s.

Due to its low viscosity, high wetting properties and excellent air release, is suitable for the manufacture of structures and composite parts by wet lay-up or filament winding while guaranteeing low toxicity working conditions to the users.

This system guarantees high inter-laminar properties and impact resistance thanks to its exceptional wetting properties even on aramid reinforcements.

Laminates can be released from the moulds after a low temperature cure cycle (8h @ 50°C). Final thermo-mechanical properties will be obtained after a post curing cycle defined according later in this technical data sheet.

TG (°C)
214
Mix density
1.09
Mix viscosity (mPa.s)
579
Gel time on 70 mL, 4cm at 23°C
8h