Applications of ET 290 for CastingApplications of ET 290 for Casting

RESOLTECH ET 290

Hardener ET 290 B

Hot curing epoxy resin for potting and impregnation

  • Hot curing
  • Low viscosity at 70°C
  • Solvent-free

ET 290 A/ET 290 B is a hot curing solvent free epoxy system formulated for the potting of electronic parts, especially when associated with porous insulating materials.
The low viscosity enables to encapsulate materials with a thickness < 4mm.

ET 290 A/ET 290 B shows excellent resistances to thermos-mechanical strains.

Mix density
1.15
Mix viscosity (mPa.s)
900
Gel time on 70 mL, 4cm at 23°C
15m